Additive Manufacturing for Semiconductor Capital Equipment

Experience Performance, Productivity, and Reliability Improvement in Semiconductor Capital Equipment

Semiconductor lithography and wafer processing equipment require constant innovation to meet the accuracy, speed, reliability, and productivity demands of increasingly complex microchip production. Additionally, the continual need for increased quality, improved total cost of ownership, reduced time to market, and minimized supply chain disruption persists.

With decades of expertise in semiconductor applications and metal additive manufacturing, 3D Systems has a dedicated team that understands these challenges and can help semiconductor OEMs and suppliers overcome them. As a complete solution provider, we will collaborate with you on application development, helping you transition from prototype to production and enabling your own metal additive capabilities.

Rapidly Adopt and Scale Metal Additive Manufacturing

How 3D Systems’ Technology Transfer & Consulting Services Benefit Semiconductor Capital Equipment Manufacturers

In this eBook, you’ll learn how 3D Systems’ decades of experience and expertise helps integrate metal AM to drive performance, productivity, and reliability improvements for semiconductor capital equipment manufacturers and suppliers.

We will look at how 3D Systems partners with manufacturers to build their AM capabilities, explore the five phases of our technology transfer process, and share additional ways we provide support and services to help you achieve your goals.

We can help you quickly scale your manufacturing capabilities in order to improve accuracy, maximize performance, and achieve a higher lifecycle value.

By partnering with us, we will help you:

  • Identify performance gaps
  • Develop advanced AM applications for your specific needs
  • Seamlessly transition to in-house metal additive manufacturing

Download our eBook to explore how our technology transfer and consulting services can benefit your business.

Advancing Semiconductor Capital Equipment Performance With Metal Additive Manufacturing

Use Metal AM to Overcome the Limitations of Existing Workflows and Meet Today’s Rising Quality and Productivity Demands

Read this executive brief to see how semiconductor capital equipment manufacturers can integrate metal AM into their manufacturing processes to rapidly deliver optimized precision components that maximize the performance, quality, yield, and reliability of their equipment.

With over two decades of semiconductor and additive manufacturing experience, 3D Systems will help you quickly adopt metal AM technology, giving you the control you need to produce high-performing, optimized parts.

Download our executive brief to learn more about the benefits of metal AM and how we can accelerate your adoption.